MS-11
Premium 3D solder paste inspection system for SMT and semiconductor processes, engineered for extreme accuracy and repeatability on today's smallest components.
Product Overview
The MIRTEC MS-11 delivers a dramatic improvement in accuracy and repeatability for 3D solder paste inspection. Its 25 mega pixel high-resolution camera with CoaXPress interface and 4µm/6µm telecentric lens options captures a large field of view in a single shot, enabling fast, precise inspection of solder paste on pads as small as 0201mm (metric) with a designated height of just 30µm — ideal for Mini-LED and advanced semiconductor applications.
Automatic warpage compensation detects and corrects PCB warpage up to ±5mm during inspection, while the optional solder supplying function automatically dispenses solder onto insufficient or missing pads after inspection. Distributed and supported by TIIHTRONICS across Mexico and Texas.
Key Features
- 25MP high-resolution camera with CoaXPress high-speed interface
- 4µm and 6µm telecentric lens options eliminate perspective distortion
- Inspection of 0201mm (metric) pads with 30µm designated height
- Large field of view captures bigger, clearer images in a single shot
- Automatic PCB warpage compensation up to ±5mm
- Optional solder supplying function for insufficient or missing pads
- Designed for both SMT and semiconductor manufacturing processes
Technical Specifications
| Camera | 25 MP high-resolution, CoaXPress interface |
| Lens | 4µm / 6µm telecentric options |
| Minimum Pad Size | 0201mm (metric) Mini-LED chips |
| Minimum Paste Height | 30µm designated height |
| Warpage Compensation | Up to ±5mm |
| Options | Solder supplying function |
| Application | SMT & semiconductor processes |
