MS-15
Flagship 3D solder paste inspection platform with dual linear motor drive for semiconductor-level repeatability at maximum throughput.
Product Overview
The MIRTEC MS-15 is the flagship of MIRTEC's premium 3D SPI line for SMT and semiconductor processes. Its dual linear motor drive delivers semiconductor-level positioning repeatability, while the 25 mega pixel high-resolution camera with CoaXPress interface and 4µm/6µm telecentric lens options measures solder paste on pads as small as 0201mm (metric) with a designated height of 30µm.
A large field of view captures bigger, clearer images in a single shot for faster inspection, automatic warpage compensation corrects PCB warpage up to ±5mm, and the optional solder supplying function dispenses solder onto insufficient or missing pads post-inspection. Distributed and supported by TIIHTRONICS across Mexico and Texas.
Key Features
- Dual linear motor drive for semiconductor-level repeatability
- 25MP high-resolution camera with CoaXPress high-speed interface
- 4µm and 6µm telecentric lens options eliminate perspective distortion
- Inspection of 0201mm (metric) pads with 30µm designated height
- Large field of view captures bigger, clearer images in a single shot
- Automatic PCB warpage compensation up to ±5mm
- Optional solder supplying function for insufficient or missing pads
Technical Specifications
| Drive System | Dual linear motor |
| Camera | 25 MP high-resolution, CoaXPress interface |
| Lens | 4µm / 6µm telecentric options |
| Minimum Pad Size | 0201mm (metric) Mini-LED chips |
| Minimum Paste Height | 30µm designated height |
| Warpage Compensation | Up to ±5mm |
| Options | Solder supplying function |
| Application | SMT & semiconductor processes |
