Reflow Soldering & Thermal Processing
SMT Reflow & Thermal
Complete reflow soldering solutions including full convection systems, inline vacuum-reflow for void reduction, and temperature treatment systems. These thermal processing platforms deliver consistent, high-reliability solder joints for advanced electronics assembly.
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SMT Reflow & Thermal Product Line
Full Convection Reflow Soldering Systems
R-Series reflow systems with 6 models (R210–R460), lambda sensor nitrogen control, tool-free maintenance, and lowest energy consumption in class.
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Inline Vacuum-Reflow Systems
V-Series systems (V290–V630) with up to 99% void reduction, stainless steel vacuum chamber, and N₂ capability.
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T-Series Horizontal Continuous Ovens
Modular horizontal conveyor system in 0.7m increments (T210–T560) for curing, drying adhesives and varnishes, with multi-track and dual-transport options.
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VH-Series Vertical Systems
Vertical workpiece carrier system with 400×400mm or 500×500mm carriers, 3–4 heating/cooling zones, minimal footprint, manual or automatic operation.
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Cube Hot/Cold Functional Test Systems
Compact chamber systems for hot (60–155°C) and cold (−50 to −10°C) functional testing with 15-second cycle times and built-in traceability.
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