HR 600 XL Rework System
Automatic rework system for complex large assemblies up to 625 × 1,250mm — exchangeable heating heads up to 4,800W, matrix IR underheating, Auto Scavenger and ±0.025mm placement accuracy.
Product Overview
The Ersa HR 600 XL is an automatic rework system engineered for the repair of complex assemblies up to 625 × 625mm in the standard configuration, expandable to 625 × 1,250mm with the optional extended bottom heating. Designed for large, high-value PCBs, the system delivers individually configurable architecture to match the demands of any rework scenario.
The system features exchangeable heating heads ranging from 800W to 4,800W, paired with a large-area matrix infrared underheating system with 25 individually controllable elements (expandable to 50). A high-precision motorized axis system provides ±0.025mm placement accuracy, while automatic component alignment via image processing with dual 5MP GigE cameras ensures exact positioning every time.
The integrated Auto Scavenger module performs automatic, contactless residual solder removal immediately after desoldering — a suction nozzle is lowered over the PCB for automated extraction without contact, ensuring clean pad surfaces for replacement components. Up to 8 thermocouple channels plus 1 VTC provide comprehensive process monitoring, all controlled and documented through HRSoft 2 operating software.
Key Features
- Exchangeable heating heads from 800W to 4,800W for flexible configuration
- Standard 60 × 60mm hybrid top heating, optional 150 × 120mm XL heating head
- Large-area matrix IR underheating with 25 individual elements (625 × 625mm)
- Expandable to 50 elements covering 625 × 1,250mm for oversized boards
- High-precision motorized axis system with ±0.025mm placement accuracy
- Automatic component alignment via image processing
- 5MP GigE color top camera (60 × 60mm FOV) for placement verification
- 5MP GigE monochrome bottom camera (60 × 60mm FOV) for component alignment
- Integrated Auto Scavenger for automatic contactless residual solder removal
- 8× K-type thermocouple channels + 1× VTC for process monitoring
- PCB thickness support up to 10mm
- Component range from 0.5 × 0.5mm to 60 × 60mm (standard), 01005 to 150 × 120mm (optional)
- HRSoft 2 operating software (Windows 8, 10, 11) for process control and documentation
- Compatible with Dip&Print Station for flux/paste application
- Optional reflow process camera for real-time monitoring
- CE certified, optional UL certification available
- Antistatic version available
Technical Specifications
| Dimensions (W×D×H) | 2,250 × 1,700 × 1,650 mm (with monitor) |
|---|---|
| Floor Space | 1,691 × 1,180 mm |
| Weight | Approx. 312 kg |
| Rated Power | 16 kW (optional: 16 kW + 15 kW extended) |
| Voltage | 3 × 400 VAC, 50–60 Hz, 30 A |
| Top Heating (Standard) | Hybrid radiator, 60 × 60 mm, 800 W |
| Top Heating (Optional XL) | 150 × 120 mm, 2,800 W |
| Bottom Heating (Standard) | IR emitter, 625 × 625 mm, 25 × 600 W |
| Bottom Heating (Extended) | IR emitter, 625 × 1,250 mm, 50 × 600 W |
| PCB Size (Standard) | Up to 625 × 625 mm |
| PCB Size (Extended) | Up to 625 × 1,250 mm |
| PCB Thickness | Up to 10 mm |
| Component Size (Standard) | 0.5 × 0.5 mm to 60 × 60 mm |
| Component Size (Optional) | 0.2 × 0.4 mm (01005) to 150 × 120 mm |
| Placement Accuracy | ±0.025 mm |
| Top Camera | 5 MP GigE color, 60 × 60 mm FOV |
| Bottom Camera | 5 MP GigE monochrome, 60 × 60 mm FOV |
| Thermocouple Channels | 8× K-type + 1× VTC |
| Compressed Air | 6–10 bar, oil-free, ¼″ quick coupling |
| Air Volume Cooling | Approx. 110 l/min @ 6 bar |
| Operating Software | HRSoft 2 (Windows 8, 10, 11) |
| Certification | CE (optional UL) |
| Antistatic | Available |
Available Variants
| Article | Description |
|---|---|
| 0HR600XL | HR 600 XL with top heating 60 × 60 mm |
| 0HR600XL-L | HR 600 XL with top heating 150 × 80 mm |
| 0SC600 | SC 600 — automatic residual solder removal |
| 0HR610XL | Reflow process camera |
| 0PR100 | Dip&Print Station |
