HR 600 P Rework System
Automated rework system for smart component repair of electronic assemblies with 5MP GigE cameras, high-precision axis system and HRSoft 2 software control.
Product Overview
The Ersa HR 600 P represents the next technological step in the professionalization and automation of rework systems. Designed for smart component repair of electronic assemblies, it features a solid machine frame, high-precision axis system with high-resolution 5MP GigE cameras for accurate component detection, and fully automated processes for component placement, soldering and desoldering.
The hybrid heating head with two heating zones delivers consistent top-side heating, while the large-area IR underheating covers 380 × 380mm across three zones. Process monitoring is enhanced by a dedicated 6.3MP reflow process camera, and three K-type thermocouple inputs enable AccuTC sensor integration for precise temperature profiling.
The optional SC 600 Auto Scavenger module provides automated, contactless residual solder removal from PCB connection surfaces — fully integrated into HRSoft 2 software and retrofittable at any time. The gentle heating technology combined with sensor-guided soldering processes ensures sustainable rework with complete process documentation.
Key Features
- High-precision axis system with ±25µm accuracy for exact component placement
- 5MP GigE color placement camera (top) for high-resolution component detection
- 5MP GigE monochrome component camera (bottom) for accurate alignment
- 6.3MP CMOS GigE color reflow process camera with 2× LED illumination for real-time monitoring
- Hybrid heating head with 800W radiators in two zones (60 × 60mm)
- Large-area IR underheating with three zones (380 × 380mm coverage)
- Three K-type thermocouple inputs for AccuTC sensor integration
- Effective component cooling using compressed air
- HRSoft 2 operating software for complete process control and documentation
- Optional SC 600 Auto Scavenger for automated residual solder removal (retrofittable)
- Component size range: 1 × 1mm to 60 × 60mm
- PCB sizes up to 642 × 423mm with optional extended holder
- Sensor-guided soldering processes for gentle, reproducible heating
Technical Specifications
| Dimensions (L×W×H) | 1,450 × 800 × 600 mm |
|---|---|
| Weight | 110 kg (128.5 kg with SC 600) |
| Power Consumption | 6,300 W (6,700 W with Scavenger) |
| Top Heater | Hybrid radiators, 800W, two zones, 60 × 60 mm |
| Bottom Heater | IR emitter, 380 × 380 mm, three zones |
| PCB Size (Standard) | Up to 380 × 300 mm |
| PCB Size (Optional) | Up to 642 × 423 mm |
| Component Size | 1 × 1 to 60 × 60 mm |
| Axis Accuracy | ±25 µm |
| Working Distance (Top) | 30–60 mm |
| Working Distance (Bottom) | 35 mm |
| Placement Camera (Top) | 5 MP GigE color |
| Component Camera (Bottom) | 5 MP GigE monochrome |
| Reflow Process Camera | 6.3 MP CMOS GigE color, 50mm focal, 2× LED |
| Thermocouple Inputs | 3× K-type (AccuTC) |
| Compressed Air | 6–10 bar, ¼" quick coupling, oil-free |
| Operating Software | HRSoft 2 |
Order Information
| Article | Description |
|---|---|
| 0HR600P | HR 600 P with standard PCB holder (380 × 300 mm) |
| 0SC600 | SC 600 automatic residual solder removal module |
