XCEED BSI – Bottom Side Inspection
Advanced 3D AOI system for high-speed bottom-side inspection of PCB assemblies, delivering laser-based defect detection without flipping the board.
Product Overview
The PARMI Xceed BSI is a 3D Automated Optical Inspection system purpose-built for bottom-side inspection of printed circuit boards. Utilizing an advanced laser line scan method, it captures accurate three-dimensional measurements of solder joints and component features on the underside of the board, enabling manufacturers to identify defects with high reliability across through-hole and surface-mount assembly processes.
One of the system’s defining advantages is its ability to perform immediate inspection without requiring a board-flipping process. This eliminates additional handling steps in the production line, reducing mechanical complexity and the risk of damage to assemblies. The Xceed BSI delivers the fastest inspection speed in its class, ensuring that quality control does not become a bottleneck in high-volume manufacturing environments.
Beyond standard solder joint inspection, the Xceed BSI simultaneously detects foreign material, contamination, and PCB warpage without adding cycle time. It handles a wide range of soldering technologies on a single platform—wave soldering, selective soldering, and bottom-side SMD—making it a versatile solution for manufacturers running mixed-technology production lines. Distributed and supported by TIIHTRONICS across Mexico and Texas.
Key Features
- 3D inspection using laser line scan method for accurate bottom-side measurement
- Fastest inspection speed in the industry for maximum throughput
- Immediate inspection without requiring a PCB flipping process
- Through-Hole Device (THD) pin solder joint inspection
- Wave soldering result inspection for comprehensive defect detection
- Selective soldering result inspection with full 3D coverage
- Bottom-side SMD component inspection capability
- Foreign material and contamination detection on the board underside
- PCB warpage and dimensional anomaly identification
- No additional cycle time for contamination and warpage checks
- Single-platform solution supporting multiple soldering technologies
- Backed by TIIHTRONICS local service, training & support in Mexico and Texas
