SIGMA X – 3D SPI
High-speed 3D solder paste inspection system utilizing laser line scan technology for real three-dimensional measurement of solder paste deposits in SMT manufacturing.
Product Overview
The PARMI Sigma X is a 3D Solder Paste Inspection (SPI) system engineered for high-volume SMT production environments. Built around PARMI’s laser line scan method, the Sigma X captures real three-dimensional images of solder paste deposits on PCBs, delivering accurate measurement data for height, area, volume, offset, bridging, and shape. Inspection results are independent of color, material composition, and surface roughness, ensuring consistent performance across a wide range of board types and paste formulations.
Positioned as the fastest SPI system in its class, the Sigma X keeps pace with the most demanding production lines without sacrificing measurement integrity. The system features automated PCB warpage measurement and automated compensation for PCB stretch and shrinkage, addressing real-world dimensional variations that occur during the manufacturing process and ensuring accuracy even on boards that exhibit significant warpage or dimensional change.
Beyond standalone inspection, the Sigma X supports process optimization through integrated feedback and feedforward linkage with other equipment in the SMT line. This closed-loop capability enables real-time adjustments to upstream printing parameters and downstream placement or reflow processes, driving continuous improvement in yield and reducing defect rates. Distributed and supported by TIIHTRONICS across Mexico and Texas.
Key Features
- Laser line scan method for true 3D solder paste measurement
- Industry-leading inspection speed for high-throughput production lines
- Real 3D image capture providing authentic volumetric data
- Inspection independent of color, material, and surface roughness
- Comprehensive measurement of height, area, volume, offset, bridge, and shape
- Automated PCB warpage measurement and compensation
- Automated compensation for PCB stretch and shrinkage
- Feedback linkage support for closed-loop printer control
- Feedforward linkage support for downstream process optimization
- Reliable inspection across diverse PCB substrates and paste types
- Backed by TIIHTRONICS local service, training & support in Mexico and Texas
